Next-Gen Optical Interposers To Connect Multiple Chiplets Together With Low Latency

Next-Gen Optical Interposers To Connect Multiple Chiplets Together With Low Latency

As the chip industry navigates into the “multi-chiplet” segment, new research has presented an interesting solution for chipset-interconnect, utilizing silicon photonics such as optical interposers. Multi-Chiplet Designs Might See Wider Adoption Through The Concept of Active Optical Interposers, Fueling Innovation In The Chip Industry The race for chiplet designs in the CPU & GPU industry has been heating up, especially when utilizing the design technique for power-efficient solutions for the market. For those who are unaware of what a chiplet is, it is a combination of different chips integrated into a single package, with an interconnected system that significantly contributes […]

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