The use of TSMC’s Small Outline Integrated Circuit Packaging was previously said to be explored by Apple, and there is a chance that the company could take advantage of this technology when introducing its upcoming M5. According to a new report, the company plans to use the same Apple Silicon in its Macs and AI servers, with the advanced packaging technology likely aiding it in achieving that strategy. M5 is currently said to be in the trial production phase on the SoIC technology, with mass production expected to happen from 2025 The California-based giant was previously reported to leverage its […]
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