Huawei Rumored To Be Working On A ‘Kirin PC Chip’ Whose Multi-Core Performance Is Close To Apple’s M3 Thanks To Its Taishan V130 Architecture

Huawei Rumored To Be Working On A ‘Kirin PC Chip’ Whose Multi-Core Performance Is Close To Apple’s M3 Thanks To Its Taishan V130 Architecture

Huawei was previously rumored to be developing an Apple M1 competitor to take that ARM-based chipset market share away from the company. However, according to the latest information, the Chinese firm is using the Taishan V130 architecture to mass produce a silicon that can come close to the M3’s multi-core performance. It appears that Qualcomm’s Snapdragon X Elite is not the only one trying to carve out a piece of the pie. New Kirin PC Chip could be divided into more powerful variants, similar to Apple’s ‘Pro’ and ‘Max’ versions, claims tipster The exact name of the chip was not […]

Read full article at https://wccftech.com/huawei-kirin-pc-chip-multi-core-close-to-apple-m3-new-architecture/

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