TSMC is set to significantly upscale its CoWoS packaging output, as the Taiwan giant plans to spend almost US $16 billion on building new facilities. TSMC Looks To Rapidly Expand Its CoWoS Output Through Massive Investments, Ensuring a Seamless Supply Chain For AI Customers CoWoS packaging has seen a tremendous rise in demand in the past year, as resources play a vital role in manufacturing AI accelerators, which are the “holy grail” of the AI industry. As we transition into the next-gen era, AI GPU suppliers wouldn’t certainly want to experience a supply chain bottleneck, which was previously caused by […]
Read full article at https://wccftech.com/tsmc-invest-16-billion-six-new-cowos-facilities-taiwan-anticipates-huge-ai-demand/
