iPhone 16 To Feature Upgraded Thermal Solution Designed For AI-Related Tasks, NAND Flash Rumored To Be Separate From Logic Board

iPhone 16 To Feature Upgraded Thermal Solution Designed For AI-Related Tasks, NAND Flash Rumored To Be Separate From Logic Board

Apple is reportedly bringing various AI-related features to the upcoming iPhone 16 family, with generative AI said to be baked into iOS 18. The company is also said to bring on-device processing instead of using cloud-based infrastructure, resulting in faster operations. However, all of this will be extremely taxing to the components, such as the chipset, NAND flash, and RAM, which is why a tipster notes that the cooling solution will be upgraded and designed specifically to handle these tasks. He also mentioned that Apple would keep the onboard memory chip away from the SoC. Keeping the NAND flash separate […]

Read full article at https://wccftech.com/iphone-16-upgraded-thermal-solution-for-ai-tasks/

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